PICLS is a thermal simulation tool that helps designers perform thermal simulation of PCBs easily and simultaneously.
Even if you are not familiar with thermal simulation, the simulation result can be obtained easily thanks to the easy and fast operation of the software in 2 dimensions.
The data of a PCB created in PICLS can be exported to scSTREAM and HeatDesigner.
Useful applications of PICLS:
External File Interface
IDF 3.0 and Gerber data can be transferred.
Considering The Simple Housing
By connecting it to the enclosure, the heat dissipation can be examined.
It can allocate and display parts such as plate fins and heat spreading plates.