Digital Image Correlation
Digital Image Correlation (DIC) is a 3-dimensional, full-area and non-contact optical measurement technique that can make contour, deformation, vibration and strain measurements on almost all materials. This technique can be used in static and dynamic test applications where tensile, torsion (torsion), bending and mixed loads are applied. The method can give results in a wide range from very small test areas at micro level to large test areas, and the measurement results coincide with the results obtained with finite element applications and strain gauges.
For more detailed information, please click on the links below the explanations and you will be directed to the relevant page on Dantec Dynamics website.
Contour, Deformation and Strain Measurement
Q-400 - DIC Standard 3D
Standard DIC system used for 3D strain, displacement and strain measurements
Q-480 - DIC Handheld (Handheld DIC)
DIC system developed for large area measurements, working with the principle of "point and pull", practical, used for displacement and strain measurements
Q-400 - µDIC (micro DIC)
DIC system developed for microscopic thermal expansion and warpage measurements
Q-400 - DIC TCT
DIC system used for thermal expansion, strain and warpage measurements
Q-450 - DIC High-Speed (High Speed DIC)
DIC system measuring with high speed cameras for vibration measurement